Magnetic solder to reduce porosity of solder joints formed in microgravity

Solder joints formed in microgravity are inferior to Earth gravity. They mechanically weaker and less electrically conductive due voids forming the when soldering microgravity. Surface tension lack of gravitational buoyancy combine prevent flux water vapors from escaping molten solder absence gravity, resulting more porous joints. Additionally, corrosive vapor products remain trapped causing further deterioration. Parabolic aircraft flight data presented, compare joint porosities conventional nonmagnetic solders new magnetic solders, determine if solder, soldered presence a field, would reduce porosity Soldering irons were used hand-solder resistor leads into PC board though-holes, for solders. Addition 4 wt% 6 iron microparticles pastes resulted 24% 28% reductions average cross-sectional porosity, respectively, relative porosity. Joint distributions log-normal, so Wilcoxon Rank Sum test statistical significance was show these statistically significant at ? = 0.05. A fully-developed wire could enable in-space repair electronics component level, giving space mission planners additional flexibility eliminate some or all spare board-level electronics, plan instead perform repairs level. This then required mass boards.